5G RedCap was finalized within the 3GPP’s Launch 17 to offer machine OEMs with a migration pathway from 4G LTE to 5G for mid-range gadgets, whose throughput necessities sit between these of enhanced Cell Broadband (eMBB) and Low-Energy Extensive-Space (LPWA). This makes 5G RedCap significantly fascinating for the IoT.
ABI Analysis, a worldwide expertise intelligence agency, forecasts IoT RedCap module shipments will accumulate to 80 million from 2024 to 2029.
“5G RedCap is a series of network and device optimizations that strips back device complexity, acting as a natural successor to LTE Cat-4 and LTE Cat-6. It is a means of providing an affordable pathway to 5G for IoT device OEMs that do not require the full spectrum of 5G capabilities,” explains Jonathan Budd, Trade Analyst at ABI Analysis.
“The mid-tier LTE Categories have proven valuable in connecting IoT devices; RedCap delivers LTE-equivalent throughput performance, with assurance of network longevity into the 5G era. Unsurprisingly, 5G RedCap is drawing significant interest across the IoT value chain, with Qualcomm, MediaTek, UNISOC, and ASR Microelectronics quick to enter the chipset market.”
The second iteration of the RedCap customary enhanced RedCap (eRedCap) will scale back machine complexity even additional to unlock one other sizeable addressable marketplace for IoT gadgets OEMs that at present use, or plan to make use of, LTE-Cat-1 and Cat-1bis. These LTE classes serve a considerable pool of IoT purposes, representing a better market alternative than 5G RedCap. From 2024 to 2029, 56 million modules, or 71% of all RedCap modules, are as a consequence of be eRedCap, with 23 million, or 29% of RedCap modules for 5G RedCap (R17).
Sequans has already introduced its intention to develop an eRedCap chip, and we will count on extra silicon distributors to observe in what’s projected to be a hyper-competitive area.
“As a replacement for LTE Cat-1 and Cat-1bis, eRedCap will be widely applicable in connecting devices across the IoT application landscape, and chipset and module manufacturers will seek to attain customer loyalty as early as possible,” concludes Budd.
